ZXSDS2M832TA
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-VDFN Exposed Pad |
| Number of Pins | 832 |
| Diode Element Material | SILICON |
| Packaging | Cut Tape (CT) |
| Published | 2003 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 10 |
| Terminal Finish | MATTE TIN |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8541.10.00.80 |
| Voltage - Rated DC | 60V |
| Terminal Position | QUAD |
| Terminal Form | FLAT |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | unknown |
| Current Rating | 1.65A |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | ZXSDS2M832 |
| Pin Count | 10 |
| JESD-30 Code | R-PQFP-F10 |
| Qualification Status | Not Qualified |
| Number of Elements | 2 |
| Power Dissipation-Max | 0.8W |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 100μA @ 45V |
| Voltage - Forward (Vf) (Max) @ If | 600mV @ 1A |
| Forward Current | 1.24A |
| Operating Temperature - Junction | -55°C~125°C |
| Application | EFFICIENCY |
| Current - Average Rectified (Io) | 1.65A DC |
| Forward Voltage | 740mV |
| Max Reverse Voltage (DC) | 60V |
| Average Rectified Current | 1.65A |
| Number of Phases | 1 |
| Reverse Recovery Time | 12 ns |
| Peak Reverse Current | 100μA |
| Max Repetitive Reverse Voltage (Vrrm) | 60V |
| Peak Non-Repetitive Surge Current | 16.8A |
| Diode Configuration | 2 Independent |
| Max Forward Surge Current (Ifsm) | 16.8A |
| Height | 1mm |
| Length | 3mm |
| Width | 2mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet