XRT75R06IB
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 217-BBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 6 |
XRT75R06IB Overview
Board space can be saved by using the 217-BBGA package.Telecommunications equipment is packed in the Tray-way.Telecommunications equipment is mounted with type Surface Mount.6 circuits are used in this telecom IC .When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.A -40°C~85°C-temperature setting offers reliable performance.
XRT75R06IB Features
Available in the 217-BBGA package
XRT75R06IB Applications
There are a lot of MaxLinear, Inc. XRT75R06IB Telecom applications.
- Channel Banks
- T3 channelized access concentrators
- Wireless base stations
- E3/DS3 Access Equipment
- Fractional T1/E1/J1
- Wireless local loop (WLL)
- PBX (Private Branch Exchange)
- T1/E1/J1 Multiplexer and Channel Banks
- Remote wireless modules
- SDH/SONET multiplexers