XRT73L04BIV
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Interface | LIU |
| Number of Circuits | 4 |
| Current - Supply | 500mA |
XRT73L04BIV Overview
Space is saved on the board by using the 144-LQFP package.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.There are 4 circuits in this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.The current supply is 500mA.
XRT73L04BIV Features
Available in the 144-LQFP package
XRT73L04BIV Applications
There are a lot of MaxLinear, Inc. XRT73L04BIV Telecom applications.
- DECT (Digital European Cordless Telephone) Base
- Fiber to the Home (FTTH)
- Remote wireless modules
- Digital cross connects (DSX-1)
- NIU
- Channel Service Units (CSUs): T1/E1/J1
- Digital Cross-connect Systems (DCS)
- Wireless local loop (WLL)
- Switching Systems
- T1/E1/J1 Performance Monitoring