| Parameters |
| Factory Lead Time |
11 Weeks |
| Package / Case |
1156-BBGA, FCBGA |
| Operating Temperature |
0°C~100°C TJ |
| Packaging |
Tray |
| Published |
2016 |
| Series |
Zynq® UltraScale+™ MPSoC EG |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| HTS Code |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Number of I/O |
360 |
| Speed |
600MHz, 667MHz, 1.5GHz |
| RAM Size |
256KB |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).It has been assigned a package 1156-BBGA, FCBGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.Housed in the state-of-art Tray package.360 I/Os in total are included in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-3FFVC1156E System On Chip (SoC) applications.
- Embedded systems
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