| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            1156-BBGA, FCBGA | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Published | 
                                            2016 | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EG | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Number of I/O | 
                                            360 | 
                                        
                                                                            
                                            | Speed | 
                                            533MHz, 600MHz, 1.3GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            256KB | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
                                        
                                                                            
                                            | Architecture | 
                                            MCU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.There is a 1156-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells, an important feature to keep in mind.Housed in the state-of-art Tray package.360 I/Os are included in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc. 
XCZU7EG-2FFVC1156I System On Chip (SoC) applications. 
- Healthcare 
 - Industrial transport
 - Sensor network-on-chip (sNoC)
 - Functional safety for critical applications in the aerospace
 - Smartphones
 - CNC control
 - Networked sensors
 - Industrial robot
 - Industrial automation devices
 - Smartphone accessories