XCZU4CG-2FBVB900I
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.85V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage-Min (Vsup) | 0.825V |
| Number of I/O | 204 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 204 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In the SoCs wireless, high voltages above 0.876V are considered dangerous and should not be used.As a minimum, the power supply of the SoC system on a chip needs to be 0.825V.As a result, there are 900 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU4CG-2FBVB900I System On Chip (SoC) applications.
- DC-input BLDC motor drive
- Microcontroller based SoC ( RISC-V, ARM)
- ARM
- Robotics
- Industrial robot
- Communication interfaces ( I2C, SPI )
- Central alarm system
- Industrial automation devices
- Personal Computers
- Apple smart watch