| Parameters |
| Factory Lead Time |
11 Weeks |
| Package / Case |
784-BFBGA, FCBGA |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Tray |
| Published |
2016 |
| Series |
Zynq® UltraScale+™ MPSoC EG |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| HTS Code |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Number of I/O |
252 |
| Speed |
500MHz, 600MHz, 1.2GHz |
| RAM Size |
256KB |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 784-BFBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 252 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3EG-1SFVC784I System On Chip (SoC) applications.
- Mobile market
- Functional safety for critical applications in the aerospace
- Multiprocessor system-on-chips (MPSoCs)
- Samsung galaxy gear
- Optical drive
- Industrial automation devices
- POS Terminals
- Vending machines
- Smart appliances
- Mouse