| Parameters |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status |
ROHS3 Compliant |
| Factory Lead Time |
11 Weeks |
| Package / Case |
625-BFBGA, FCBGA |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Bulk |
| Published |
2016 |
| Series |
Zynq® UltraScale+™ MPSoC CG |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| HTS Code |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Number of I/O |
180 |
| Speed |
500MHz, 1.2GHz |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is embedded in this SoC.Package 625-BFBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq? UltraScale+? MPSoC CG series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells and that is something to note.It is packaged in a state-of-the-art Bulk package.180 I/Os in total are included in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-1SFVA625I System On Chip (SoC) applications.
- Multiprocessor system-on-chips (MPSoCs)
- Microcontroller based SoC ( RISC-V, ARM)
- Transmitters
- Automated sorting equipment
- POS Terminals
- Mobile market
- CNC control
- RISC-V
- Networked sensors
- Microprocessors