XCZU2CG-2SFVC784I
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 784-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 784 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.85V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B784 |
| Number of I/O | 252 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC CG is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 252 inputs and outputs.A 0.85V power supply is recommended.The system on a chip uses 784 terminations in total.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2CG-2SFVC784I System On Chip (SoC) applications.
- Robotics
- ARM
- Sensor network-on-chip (sNoC)
- Industrial automation devices
- Functional safety for critical applications in the automotive
- CNC control
- Video Imaging
- Automotive
- Healthcare
- Servo drive control module