| Parameters |
| Factory Lead Time |
11 Weeks |
| Package / Case |
1517-BBGA, FCBGA |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Tray |
| Published |
2016 |
| Series |
Zynq® UltraScale+™ MPSoC EG |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| HTS Code |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Number of I/O |
644 |
| Speed |
500MHz, 600MHz, 1.2GHz |
| RAM Size |
256KB |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.There is a 1517-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 926K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.644 I/Os are included in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU17EG-1FFVB1517I System On Chip (SoC) applications.
- Level
- Medical
- Networked sensors
- Communication interfaces ( I2C, SPI )
- Medical Pressure
- Robotics
- Body control module
- Automotive
- Remote control
- Special Issue Editors