XC7Z045-3FBG676E

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, which is great for system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.There are a number of features to this SoC meaning which are based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-3FBG676E System On Chip (SoC) applications.

• Efficient hardware for training of neural networks
• PC peripherals
• Medical
• Temperature Sensors
• Robotics
• Central inverter
• Functional safety for critical applications in the industrial sectors
• Medical Pressure
• Personal Computers
• Networked Media Encode/Decode