| Parameters |
| Factory Lead Time |
10 Weeks |
| Contact Plating |
Copper, Silver, Tin |
| Package / Case |
400-LFBGA, CSPBGA |
| Surface Mount |
YES |
| Number of Pins |
400 |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Tray |
| Published |
2010 |
| Series |
Zynq®-7000 |
| JESD-609 Code |
e1 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
400 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code |
8542.39.00.01 |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
260 |
| Supply Voltage |
1V |
| Terminal Pitch |
0.8mm |
| Frequency |
766MHz |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| Base Part Number |
XC7Z010 |
| Operating Supply Voltage |
1V |
| Supply Voltage-Max (Vsup) |
1.05V |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Data Bus Width |
32b |
| Core Architecture |
ARM |
| Boundary Scan |
YES |
| Speed Grade |
-2 |
| RAM (words) |
256000 |
| Primary Attributes |
Artix™-7 FPGA, 28K Logic Cells |
| Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) |
1.6mm |
| Length |
17mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 400-LFBGA, CSPBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.Taking note of the fact that this SoC security combines Artix?-7 FPGA, 28K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.130 I/Os are available in this SoC part.A 1V power supply should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.A system on a chip benefits from having 400 terminations.XC7Z010 can help you find system on chips with similar specs and purposes.766MHz is the wireless SoC's frequency.There are a number of features to this SoC meaning which are based on the core architecture of ARM.This is the version with 400 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-2CLG400I System On Chip (SoC) applications.
- Cyberphysical system-on-chip
- Special Issue Information
- Fitness
- Industrial
- Automated sorting equipment
- Avionics
- Wireless networking
- Remote control
- External USB hard disk/SSD
- Body control module