| Parameters | 
                                
                                                                                                            
                                            | Terminal Form | 
                                            BALL | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Supply Voltage | 
                                            0.85V | 
                                        
                                                                            
                                            | Terminal Pitch | 
                                            0.8mm | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | JESD-30 Code | 
                                            S-PBGA-B784 | 
                                        
                                                                            
                                            | Number of I/O | 
                                            128 | 
                                        
                                                                            
                                            | Speed | 
                                            500MHz, 1.2GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            1.8MB | 
                                        
                                                                            
                                            | uPs/uCs/Peripheral ICs Type | 
                                            MICROPROCESSOR CIRCUIT | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, I2C, SPI, UART/USART, USB | 
                                        
                                                                            
                                            | Architecture | 
                                            MPU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 
                                        
                                                                            
                                            | Height Seated (Max) | 
                                            3.32mm | 
                                        
                                                                            
                                            | Length | 
                                            23mm | 
                                        
                                                                            
                                            | Width | 
                                            23mm | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            784-BFBGA, FCBGA | 
                                        
                                                                            
                                            | Surface Mount | 
                                            YES | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~125°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EG | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | Number of Terminations | 
                                            784 | 
                                        
                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Technology | 
                                            CMOS | 
                                        
                                                                            
                                            | Terminal Position | 
                                            BOTTOM | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.A SoC chip with 1.8MB RAM is provided for users to enjoy reliable performance.The SoC design uses MPU, FPGA architecture for its internal architecture.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.This SoC meaning should have an average operating temperature of -40°C~125°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.128 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 784 terminations, so system on a chip is really aided by this.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc. 
XAZU3EG-1SFVC784Q System On Chip (SoC) applications. 
- Efficient hardware for inference of neural networks
 - CNC control
 - Samsung galaxy gear
 - Microprocessors
 - Communication network-on-Chip (cNoC)
 - Robotics
 - Automotive gateway
 - Industrial AC-DC
 - Medical Pressure 
 - Industrial