XA7Z010-1CLG400Q
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 400-LFBGA, CSPBGA |
| Number of Pins | 400 |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Automotive, AEC-Q100, Zynq®-7000 XA |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 400 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other uPs/uCs/Peripheral ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Terminal Pitch | 0.8mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1V |
| Power Supplies | 11.8V |
| Interface | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| UV Erasable | N |
| Height Seated (Max) | 1.6mm |
| Length | 17mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.A MCU, FPGA technique is used for the SoC design's internal architecture.Featured system on chip SoCs of the Automotive, AEC-Q100, Zynq?-7000 XA series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 28K Logic Cells, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 130 inputs and outputs.In total, there are 400 terminations, which makes system on a chip possible.This system on a chip is just as capable as any other high-quality Other uPs/uCs/Peripheral ICs.There is 11.8V power supply requirement for this system on chip SoC.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.667MHz is the wireless SoC's frequency.It uses ARM as its core architecture.The computer SoC has a pin count of 400.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z010-1CLG400Q System On Chip (SoC) applications.
- Industrial Pressure
- External USB hard disk/SSD
- Healthcare
- Multiprocessor system-on-chips (MPSoCs)
- Smartphone accessories
- Functional safety for critical applications in the automotive
- DC-input BLDC motor drive
- Samsung galaxy gear
- Transmitters
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