VSC7104VP-01
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 69-FBGA |
| Supplier Device Package | 69-BGA |
| Operating Temperature | 0°C~110°C |
| Packaging | Tray |
| Published | 2004 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Max Operating Temperature | 110°C |
| Min Operating Temperature | 0°C |
| Power (Watts) | 1.5W |
| Max Power Dissipation | 1.5W |
| Voltage - Supply | 2.5V 3.3V |
| Function | Quad Signal Conditioner |
| Interface | TTL/CMOS |
| Number of Circuits | 4 |
| RoHS Status | RoHS Compliant |
VSC7104VP-01 Overview
A 69-FBGA package saves space on a board.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.This telecom IC is composed of 4 circuits.2.5V 3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A 0°C~110°C-temperature setting offers reliable performance.Telecom switching is mounted in the way of Surface Mount.As a precaution, the temperature is set at a minimum value of 0°C in order to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 110°C.
VSC7104VP-01 Features
Available in the 69-FBGA package
VSC7104VP-01 Applications
There are a lot of Microsemi Corporation VSC7104VP-01 Telecom applications.
- High-Density T1/E1/J1 interfaces for Multiplexers
- Remote wireless modules
- Stations
- T1 Digital Cross Connects (DSX-1)
- ISDN Primary Rate Interface
- Cable PC
- Wireless local loop (WLL)
- Voice over packet gateways
- PDH Multiplexers
- Digital Cross Connect Systems