TPS65950BZXN
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 209-VFBGA |
| Supplier Device Package | 209-NFBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | Mobile/OMAP™ |
| Voltage - Supply | 2.7V~4.5V |
| RoHS Status | ROHS3 Compliant |
TPS65950BZXN Overview
Ready for shipping the power management in Tray package.It is packaged the power management in 209-VFBGA for convenient transportation.For easy adaptability, Surface Mount provides a universal mounting method.There are a number of applications targeted at Mobile/OMAP? .It is recommended that you set the operating temperature of the power management ic to -40°C~85°C in order to prevent malfunctions.The power management operates at 2.7V~4.5V volts.
TPS65950BZXN Features
Mainly used in Mobile/OMAP? applications
Operating temperature: -40°C~85°C
TPS65950BZXN Applications
There are a lot of Rochester Electronics, LLC TPS65950BZXNPower Management applications.
- Desktop PC
- DSP
- Digital Signage
- SmartPhones
- Automotive Advanced Driver Assistance System (ADAS)
- Cluster
- LP2996A: DDR1
- System Health Monitoring
- Storage Systems
- FPGA, DSP Core Power