| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks | 
| Lifecycle Status | ACTIVE (Last Updated: 6 months ago) | 
| Mounting Type | Surface Mount | 
| Package / Case | 100-LQFP | 
| Surface Mount | YES | 
| Number of Pins | 100 | 
| Operating Temperature | -40°C~85°C TA | 
| Packaging | Tray | 
| Series | STM32F1 | 
| JESD-609 Code | e4 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
| Number of Terminations | 100 | 
| Termination | SMD/SMT | 
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 
| Subcategory | Microcontrollers | 
| Max Power Dissipation | 434mW | 
| Technology | CMOS | 
| Terminal Position | QUAD | 
| Terminal Form | GULL WING | 
| Peak Reflow Temperature (Cel) | 250 | 
| Supply Voltage | 3.3V | 
| Terminal Pitch | 0.5mm | 
| Frequency | 36MHz | 
| Base Part Number | STM32F101 | 
| Pin Count | 100 | 
| Supply Voltage-Min (Vsup) | 2V | 
| Interface | I2C, IrDA, LIN, SPI, UART, USART | 
| Memory Size | 512kB | 
| Oscillator Type | Internal | 
| Number of I/O | 80 | 
| RAM Size | 48K x 8 | 
| Voltage - Supply (Vcc/Vdd) | 2V~3.6V | 
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | 
| Number of Bits | 32 | 
| Core Processor | ARM® Cortex®-M3 | 
| Peripherals | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT | 
| Program Memory Type | FLASH | 
| Core Size | 32-Bit | 
| Program Memory Size | 512KB 512K x 8 | 
| Connectivity | I2C, IrDA, LINbus, SPI, UART/USART | 
| Bit Size | 32 | 
| Data Converter | A/D 16x12b; D/A 2x12b | 
| Watchdog Timer | Yes | 
| Has ADC | YES | 
| DMA Channels | YES | 
| Data Bus Width | 32b | 
| Number of Timers/Counters | 6 | 
| Address Bus Width | 32b | 
| Density | 4 Mb | 
| Core Architecture | ARM | 
| Number of ADC Channels | 1 | 
| Number of PWM Channels | 16 | 
| Number of I2C Channels | 2 | 
| Number of SPI Channels | 3 | 
| Height | 1.45mm | 
| Length | 14mm | 
| Width | 14.2mm | 
| Radiation Hardening | No | 
| REACH SVHC | No SVHC | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Lead Free | 
The STM32F101xC, STM32F101xD, and STM32F101xE access line family incorporates the high-performance ARM? Cortex?-M3 32-bit RISC core operating at a 36 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 48 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer one 12-bit ADC, four general-purpose 16-bit timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, and five USARTs. The STM32F101xx high-density access line family operates in the –40 to +85 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving modes allows for the design of low-power applications.
Core: ARM? 32-bit Cortex?-M3 CPU
– 36 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance
– Single-cycle multiplication and hardware
division
Memories
– 256 to 512 Kbytes of Flash memory
– up to 48 Kbytes of SRAM
– Flexible static memory controller with 4
Chip Select. Supports Compact Flash,
SRAM, PSRAM, NOR and NAND
memories
– LCD parallel interface, 8080/6800 modes
Clock, reset, and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
capability
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
1 x 12-bit, 1 μs A/D converters (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
2 × 12-bit D/A converters