| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks | 
| Lifecycle Status | ACTIVE (Last Updated: 7 months ago) | 
| Mounting Type | Surface Mount | 
| Package / Case | 36-VFQFN Exposed Pad | 
| Surface Mount | YES | 
| Number of Pins | 36 | 
| Operating Temperature | -40°C~85°C TA | 
| Packaging | Tray | 
| Series | STM32F1 | 
| JESD-609 Code | e3 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
| Number of Terminations | 36 | 
| Terminal Finish | Matte Tin (Sn) - annealed | 
| Subcategory | Microcontrollers | 
| Max Power Dissipation | 1.11W | 
| Technology | CMOS | 
| Terminal Position | QUAD | 
| Peak Reflow Temperature (Cel) | 260 | 
| Supply Voltage | 3.3V | 
| Terminal Pitch | 0.5mm | 
| Frequency | 36MHz | 
| Time@Peak Reflow Temperature-Max (s) | 30 | 
| Base Part Number | STM32F101 | 
| Pin Count | 36 | 
| Supply Voltage-Max (Vsup) | 3.6V | 
| Supply Voltage-Min (Vsup) | 2V | 
| Interface | I2C, IrDA, LIN, SPI, UART, USART | 
| Memory Size | 32kB | 
| Oscillator Type | Internal | 
| Number of I/O | 26 | 
| RAM Size | 6K x 8 | 
| Voltage - Supply (Vcc/Vdd) | 2V~3.6V | 
| Core Processor | ARM® Cortex®-M3 | 
| Peripherals | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT | 
| Program Memory Type | FLASH | 
| Core Size | 32-Bit | 
| Program Memory Size | 32KB 32K x 8 | 
| Connectivity | I2C, IrDA, LINbus, SPI, UART/USART | 
| Bit Size | 32 | 
| Data Converter | A/D 10x12b | 
| Watchdog Timer | Yes | 
| Has ADC | YES | 
| DMA Channels | YES | 
| Data Bus Width | 32b | 
| Number of Timers/Counters | 2 | 
| Core Architecture | ARM | 
| CPU Family | CORTEX-M3 | 
| Number of ADC Channels | 10 | 
| Number of PWM Channels | 4 | 
| Number of I2C Channels | 1 | 
| Height | 1mm | 
| Length | 6mm | 
| Width | 6.125mm | 
| Radiation Hardening | No | 
| REACH SVHC | No SVHC | 
| RoHS Status | ROHS3 Compliant | 
| Lead Free | Lead Free | 
The STM32F101x4 and STM32F101x6 Low-density access line family incorporates the high-performance ARM Cortex?-M3 32-bit RISC core operating at a 36 MHz frequency, high-speed embedded memories (Flash memory of 16 to 32 Kbytes and SRAM of 4 to 6 Kbytes), and an extensive range of enhanced peripherals and I/Os connected to two APB buses. All devices offer standard communication interfaces (one I2C, one SPI, and two USARTs), one 12-bit ADC and up to two general-purpose 16-bit timers. The STM32F101xx Low-density access line family operates in the –40 to +85 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
? Core: ARM? 32-bit Cortex?-M3 CPU
– 36 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 wait state memory
access
– Single-cycle multiplication and hardware
division
? Memories
– 16 to 32 Kbytes of Flash memory
– 4 to 6 Kbytes of SRAM
? Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
? Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
? Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
? DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
I
2Cs and USARTs
? 1 × 12-bit, 1 μs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
? Up to 51 fast I/O ports
– 26/37/51 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
low-power applications