| Parameters |
| Mounting Type |
Surface Mount |
| Package / Case |
96-LFBGA |
| Surface Mount |
YES |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Published |
2005 |
| JESD-609 Code |
e0 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
96 |
| Terminal Finish |
Tin/Lead (Sn/Pb) |
| HTS Code |
8542.39.00.01 |
| Subcategory |
Other Logic ICs |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
240 |
| Number of Functions |
1 |
| Supply Voltage |
1.7V~1.9V |
| Terminal Pitch |
0.8mm |
| Time@Peak Reflow Temperature-Max (s) |
20 |
| Base Part Number |
74SSTUH32864 |
| Pin Count |
96 |
| JESD-30 Code |
R-PBGA-B96 |
| Qualification Status |
Not Qualified |
| Power Supplies |
1.8V |
| Number of Bits |
25, 14 |
| Output Characteristics |
OPEN-DRAIN |
| Logic Type |
1:2 Configurable Registered Buffer |
| Output Polarity |
COMPLEMENTARY |
| Trigger Type |
POSITIVE EDGE |
| Propagation Delay (tpd) |
1.8 ns |
| fmax-Min |
450 MHz |
| Height Seated (Max) |
1.5mm |
| Length |
13.5mm |
| Width |
5.5mm |
| RoHS Status |
ROHS3 Compliant |
SSTUH32864EC,557 Overview
Packing is accomplished by using Tray.It is accessible to the 96-LFBGA package.In order to ensure that the device will work normally, the voltage 1.7V~1.9V is supplied.It is a type of electronic part mounted in the way of Surface Mount.This device operates at a temperature of 0°C~70°C.Using the memory, information is stored in 25, 14 bits.Its base part number 74SSTUH32864 identifies a number of related parts.A total of 96 pins are present on the component.The 96 terminations prevent signals from reflecting off the end of the transmission line.As a subcategory of Other Logic ICs, it can be included.For convenient use, the power supplies of 1.8V should be maintained.
SSTUH32864EC,557 Features
SSTUH32864EC,557 Applications
There are a lot of NXP USA Inc. SSTUH32864EC,557 Specialty Logic ICs applications.
- TV signal transmission
- LAN, SAN, WAN (local, storage, work area networks)
- Laser diode bonding
- Fast Ethernet
- interconnection between switches
- Wireless multimedia center in smart home
- Vehicle, ship, aircraft navigation and positioning
- Wireless interactive experience
- WDM transmission
- Data center