| Parameters | |
|---|---|
| Factory Lead Time | 49 Weeks | 
| Mount | Surface Mount | 
| Package / Case | 2-VDFN Exposed Pad | 
| Number of Pins | 3 | 
| Diode Element Material | SILICON | 
| Operating Temperature | 175°C TJ | 
| Packaging | Cut Tape (CT) | 
| Published | 2010 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 2 | 
| Termination | SMD/SMT | 
| ECCN Code | EAR99 | 
| HTS Code | 8541.10.00.80 | 
| Technology | POSITIVE-INTRINSIC-NEGATIVE | 
| Terminal Position | DUAL | 
| Terminal Form | C BEND | 
| Peak Reflow Temperature (Cel) | 260 | 
| Base Part Number | SMP1330-085 | 
| Pin Count | 3 | 
| JESD-30 Code | S-PDSO-C2 | 
| Number of Elements | 1 | 
| Max Current Rating | 200mA | 
| Power Dissipation-Max | 3W | 
| Element Configuration | Common Anode | 
| Diode Type | PIN - Single | 
| Power Dissipation | 30W | 
| Case Connection | CATHODE | 
| Forward Current | 200mA | 
| Application | LIMITER | 
| Capacitance @ Vr, F | 1pF @ 0V 1MHz | 
| Reverse Voltage | 50V | 
| Reverse Voltage (DC) | 50V | 
| Frequency Band | HIGH FREQUENCY TO C B | 
| Resistance @ If, F | 2Ohm @ 10mA 100MHz | 
| Diode Capacitance-Max | 1pF | 
| Minority Carrier Lifetime-Nom | 0.004 μs | 
| Diode Forward Resistance-Max | 2Ohm | 
| Radiation Hardening | No | 
| RoHS Status | ROHS3 Compliant |