SI4705-D60-GM
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Plating | Tin |
| Package / Case | 20-UFQFN Exposed Pad |
| Surface Mount | YES |
| Number of Pins | 20 |
| Operating Temperature | -20°C~85°C |
| Packaging | Tray |
| Published | 1997 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 24 |
| ECCN Code | EAR99 |
| Applications | General Purpose |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Consumer ICs |
| Technology | CMOS |
| Voltage - Supply | 2.7V~5.5V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Number of Functions | 1 |
| Terminal Pitch | 0.635mm |
| Depth | 3mm |
| Frequency | 64MHz~108MHz |
| Pin Count | 24 |
| JESD-30 Code | R-PDSO-G24 |
| Supply Voltage-Max (Vsup) | 5.5V |
| Power Supplies | 1.8/3.33/5V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Data Interface | PCB, Surface Mount |
| Consumer IC Type | AUDIO SINGLE CHIP RECEIVER |
| Signal to Noise Ratio (SNR) | 58 dB |
| Current - Receiving | 10.5mA |
| Modulation or Protocol | FM |
| Harmonic Distortion | 0.1% |
| Antenna Connector | PCB, Surface Mount |
| Output Voltage-Nom (FM) | 80mV |
| Demodulation Type | FM |
| Height Seated (Max) | 2mm |
| Length | 3mm |
| Width | 3.9mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
SI4705-D60-GM Overview
RF Receiver is contained in a package named 20-UFQFN Exposed Pad.In this case, RF transmitter and receiver is package of packaged in the way of Tray.A voltage of 2.7V~5.5V is supplied to this RF Receiver.It finds its uses in General Purpose mainly.At DUAL, it has RF transmitter and receiver's terminals.At a frequency of 64MHz~108MHz, it exhibits excellent efficiency.There are a total of 24 terminations of RF Receiver associated with it.
SI4705-D60-GM Features
20-UFQFN Exposed Pad package
64MHz~108MHz
24 terminations
SI4705-D60-GM Applications
There are a lot of Silicon Labs SI4705-D60-GM RF Receivers applications.
- Sensors
- Microwave radios
- Automated test equipment
- Lightings
- Optical transmission devices
- Low Bitrate ISM-band Communication Systems
- Cellular infrastructure
- Mesh Network
- Embedded Processor
- Microprocessor