SI32269-C-FM1R
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tape & Reel (TR) |
| Published | 2000 |
| Series | ProSLIC® |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32269-C-FM1R Overview
Board space can be saved by using the QFN package.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.The telecom IC is composed of 1 circuits.A higher supply voltage for 3.3V will improve efficiency.A Surface Mount-axis mounts telecom switching.It uses the DIGITAL SLIC IC type for its telecom IC.There are many similarities between it and the electronic parts of the ProSLIC? series.
SI32269-C-FM1R Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32269-C-FM1R Applications
There are a lot of Silicon Labs SI32269-C-FM1R Telecom applications.
- CSU/DSU Equipment
- PCM channel bank
- T2 Rates PCM Line Interface
- E1 Network Equipment
- Wireless base stations
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Stations
- Wireless local loop (WLL)
- ISDN Primary Rate Interfaces (PRA)
- T1/E1/J1 LAN/WAN Routers