SI32269-C-FM1
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tray |
| Published | 1993 |
| Series | ProSLIC® |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32269-C-FM1 Overview
The QFN package reduces the amount of space on a board.The way of Tray is employed for telecommunications equipment packing.The mounting type of this telecom circuit is Surface Mount.A 1-circuit composes this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Mounted in Surface Mount-direction.It uses a DIGITAL SLIC type telecom IC.This part can perform many functions similar to the electronic parts under the ProSLIC? series.
SI32269-C-FM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32269-C-FM1 Applications
There are a lot of Silicon Labs SI32269-C-FM1 Telecom applications.
- E2 Rates PCM Line Interface
- Digital access cross connects
- T1/E1/J1 LAN/WAN Routers
- Intelligent PBX
- Network Multiplexing and Terminating Equipment
- Residential Gateways
- SDH Multiplexers
- Fiber to the Home (FTTH)
- Short/Medium Loop
- Add/Drop multiplexers (ADMs)