 
    | Parameters | |
|---|---|
| Factory Lead Time | 24 Weeks | 
| Mount | Surface Mount | 
| Mounting Type | Surface Mount | 
| Package / Case | 2-SMD, Flat Lead | 
| Diode Element Material | SILICON | 
| Packaging | Tape & Reel (TR) | 
| Published | 2015 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 2 | 
| ECCN Code | EAR99 | 
| Max Operating Temperature | 150°C | 
| Min Operating Temperature | -55°C | 
| Additional Feature | LOW LEAKAGE CURRENT | 
| HTS Code | 8541.10.00.80 | 
| Capacitance | 115pF | 
| Max Power Dissipation | 830mW | 
| Terminal Position | BOTTOM | 
| Terminal Form | NO LEAD | 
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | 
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | 
| JESD-30 Code | R-XBCC-N2 | 
| Number of Elements | 1 | 
| Element Configuration | Single | 
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | 
| Diode Type | Schottky | 
| Current - Reverse Leakage @ Vr | 150μA @ 20V | 
| Voltage - Forward (Vf) (Max) @ If | 470mV @ 2A | 
| Case Connection | ANODE | 
| Forward Current | 2A | 
| Operating Temperature - Junction | -55°C~150°C | 
| Output Current-Max | 2A | 
| Application | EFFICIENCY | 
| Forward Voltage | 470mV | 
| Max Reverse Voltage (DC) | 20V | 
| Average Rectified Current | 2A | 
| Number of Phases | 1 | 
| Peak Reverse Current | 150μA | 
| Max Repetitive Reverse Voltage (Vrrm) | 20V | 
| Capacitance @ Vr, F | 115pF @ 4V 1MHz | 
| Max Forward Surge Current (Ifsm) | 20A | 
| RoHS Status | ROHS3 Compliant |