SDM1L30CSP-7
| Parameters | |
|---|---|
| Factory Lead Time | 24 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 2-SMD, No Lead |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2014 |
| JESD-609 Code | e2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Copper (Sn/Cu) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Terminal Position | BOTTOM |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 1mA @ 30V |
| Voltage - Forward (Vf) (Max) @ If | 400mV @ 1A |
| Forward Current | 1A |
| Operating Temperature - Junction | -55°C~150°C |
| Output Current-Max | 1A |
| Max Reverse Voltage (DC) | 30V |
| Average Rectified Current | 1A |
| Peak Reverse Current | 1mA |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Capacitance @ Vr, F | 150pF @ 5V 1MHz |
| Peak Non-Repetitive Surge Current | 25A |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet