| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | SOD-882 |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Terminal Position | BOTTOM |
| Pin Count | 2 |
| Reference Standard | AEC-Q101; IEC-60134 |
| Number of Elements | 1 |
| Power Dissipation-Max | 0.315W |
| Element Configuration | Single |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 500nA @ 10V |
| Voltage - Forward (Vf) (Max) @ If | 450mV @ 10mA |
| Forward Current | 200mA |
| Operating Temperature - Junction | 150°C Max |
| Forward Voltage | 640mV |
| Max Reverse Voltage (DC) | 30V |
| Average Rectified Current | 200mA |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Peak Non-Repetitive Surge Current | 3A |
| Natural Thermal Resistance | 70 °C/W |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |