| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | SOD-128 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 2.5W |
| Terminal Position | DUAL |
| Terminal Form | FLAT |
| Reach Compliance Code | not_compliant |
| Base Part Number | PMEG6020 |
| Pin Count | 2 |
| Reference Standard | AEC-Q101; IEC-60134 |
| JESD-30 Code | R-PDSO-F2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 150μA @ 60V |
| Voltage - Forward (Vf) (Max) @ If | 530mV @ 2A |
| Forward Current | 2A |
| Operating Temperature - Junction | 175°C Max |
| Output Current-Max | 2.8A |
| Application | EFFICIENCY |
| Forward Voltage | 460mV |
| Max Reverse Voltage (DC) | 60V |
| Average Rectified Current | 2A |
| Number of Phases | 1 |
| Reverse Recovery Time | 8.6 ns |
| Peak Reverse Current | 150μA |
| Max Repetitive Reverse Voltage (Vrrm) | 60V |
| Capacitance @ Vr, F | 240pF @ 1V 1MHz |
| Peak Non-Repetitive Surge Current | 50A |
| Max Forward Surge Current (Ifsm) | 50A |
| Natural Thermal Resistance | 12 °C/W |
| RoHS Status | ROHS3 Compliant |