| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 6-UDFN Exposed Pad |
| Number of Pins | 6 |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Terminal Finish | Tin (Sn) |
| Max Power Dissipation | 515mW |
| Pin Count | 6 |
| Number of Channels | 2 |
| Element Configuration | Dual |
| Turn On Delay Time | 7 ns |
| FET Type | 2 P-Channel (Dual) |
| Rds On (Max) @ Id, Vgs | 79m Ω @ 2A, 4.5V |
| Vgs(th) (Max) @ Id | 1.25V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 600pF @ 10V |
| Gate Charge (Qg) (Max) @ Vgs | 7.5nC @ 4.5V |
| Rise Time | 16ns |
| Drain to Source Voltage (Vdss) | 20V |
| Fall Time (Typ) | 15 ns |
| Turn-Off Delay Time | 33 ns |
| Continuous Drain Current (ID) | 3A |
| Gate to Source Voltage (Vgs) | -1V |
| Max Dual Supply Voltage | -20V |
| Drain to Source Breakdown Voltage | -20V |
| FET Feature | Logic Level Gate |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |