| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Surface Mount | YES |
| Supplier Device Package | 337-PBGA (21x21) |
| Packaging | Tray |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 337 |
| ECCN Code | 3A001.A.3 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Applications | Bridge, PCI to Generic Local Bus |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Voltage - Supply | 3.3V 5V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 2.5V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B337 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 70°C |
| Temperature Grade | COMMERCIAL |
| Interface | PCI |
| Clock Frequency | 66MHz |
| Bus Compatibility | PCI |
| Height Seated (Max) | 2mm |
| Length | 21mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |