MMSD301T1G
| Parameters | |
|---|---|
| Width | 1.8mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
| Contact Plating | Tin |
| Mounting Type | Surface Mount |
| Package / Case | SOD-123 |
| Surface Mount | YES |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Cut Tape (CT) |
| Published | 2007 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8541.10.00.60 |
| Voltage - Rated DC | 30V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Current Rating | 100mA |
| Base Part Number | MMSD301 |
| Pin Count | 2 |
| Reference Standard | AEC-Q101 |
| Number of Elements | 1 |
| Polarity | Standard |
| Element Configuration | Single |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 200nA @ 25V |
| Power Dissipation | 225mW |
| Output Current | 200mA |
| Voltage - Forward (Vf) (Max) @ If | 600mV @ 10mA |
| Forward Current | 200mA |
| Max Reverse Leakage Current | 200nA |
| Operating Temperature - Junction | -55°C~125°C |
| Application | EFFICIENCY |
| Current - Average Rectified (Io) | 200mA DC |
| Forward Voltage | 600mV |
| Max Reverse Voltage (DC) | 30V |
| Average Rectified Current | 200mA |
| Number of Phases | 1 |
| Peak Reverse Current | 200nA |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Capacitance @ Vr, F | 1.5pF @ 0V 1MHz |
| Max Forward Surge Current (Ifsm) | 1A |
| Reverse Voltage (DC) | 30V |
| Height | 1.25mm |
| Length | 2.84mm |
See Relate Datesheet