MINISMDC110F-2
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 1812 (4532 Metric), Concave |
| Surface Mount | YES |
| Terminal Shape | WRAPAROUND |
| Operating Temperature | -40°C~85°C |
| Packaging | Cut Tape (CT) |
| Published | 2011 |
| Series | PolySwitch®, miniSMD |
| Size / Dimension | 0.179Lx0.128W 4.55mmx3.24mm |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 2A (4 Weeks) |
| Number of Terminations | 2 |
| Type | Polymeric |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Additional Feature | RESISTANCE RANGE(RMIN-R1MAX): 0.04-0.21 |
| Packing Method | TR |
| Approval Agency | CSA, TUV, UL |
| Operating Supply Voltage | 8V |
| Terminal Placement | DUAL |
| Current - Max | 100A |
| Rated (AC) Voltage (URac) | 8V |
| Hold Current | 1.1A |
| Thermistor Application | OVERLOAD PROTECTION |
| Voltage - Max | 8V |
| Time to Trip | 300ms |
| Resistance - Initial (Ri) (Min) | 40mOhm |
| Resistance - Post Trip (R1) (Max) | 210mOhm |
| Trip Current | 2.2A |
| Thickness (Max) | 0.024 0.62mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet