| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
400-LFBGA |
| Operating Temperature |
-20°C~105°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2002 |
| Series |
i.MX6SX |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
227MHz, 1GHz |
| Core Processor |
ARM® Cortex®-A9, ARM® Cortex®-M4 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.15V |
| Ethernet |
10/100/1000Mbps (2) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
| Additional Interfaces |
AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ MPE |
| Security Features |
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
| Display & Interface Controllers |
Keypad, LCD, LVDS |
| RoHS Status |
ROHS3 Compliant |
MCIMX6X3EVK10ABR Overview
With a packing size of 400-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved by using advanced packaging methods Tape & Reel (TR). There are 2 Core 32-Bit cores per bus width on the CPU. Understand how the operating temperature around -20°C~105°C TJ is determined. From the i.MX6SX series. The CPU is cored by a processor with a number of 0 cores. Memory controllers for this CPU are LPDDR2, LVDDR3, DDR3. Featuring AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces, this microprocessor can better serve you. This CPU runs I/O at 1.8V 2.5V 2.8V 3.15V.
MCIMX6X3EVK10ABR Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X3EVK10ABR Applications
There are a lot of NXP USA Inc. MCIMX6X3EVK10ABR Microprocessor applications.
- 8. Navigation control field
- Automobile
- Copiers
- Printers
- Robots
- Heater/Fan
- Glucose monitoring systems (for Type 1 Diabetes)
- Industrial instrumentation devices
- Network communication, mobile communication field
- DCS control intelligent sensor