| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
624-FBGA, FCBGA |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2002 |
| Series |
i.MX6Q |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
852MHz |
| Core Processor |
ARM® Cortex®-A9 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
4 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (4) |
| Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers |
Keypad, LCD |
| SATA |
SATA 3Gbps (1) |
| RoHS Status |
ROHS3 Compliant |
MCIMX6Q6AVT08ADR Overview
Packed in 624-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 4 Core 32-Bit cores/bus width. Obtain a basic understanding of operating temperature around 0°C. In the series i.MX6Q, it is found. Core-wise, this CPU has a ARM? Cortex?-A9 processor. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. At 1.8V 2.5V 2.8V 3.3V, the CPU runs its I/O.
MCIMX6Q6AVT08ADR Features
ARM? Cortex?-A9 Core
MCIMX6Q6AVT08ADR Applications
There are a lot of NXP USA Inc. MCIMX6Q6AVT08ADR Microprocessor applications.
- Safety field
- Information appliances (networking of household appliances)
- Home video and audio
- Kindle
- Process control devices
- Oscilloscopes
- Communication-bluetooth, Wi-Fi, radio
- Volt meter
- Food and beverage
- Industrial instrumentation devices