| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-FBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | i.MX6Q |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| ECCN Code | 5A992 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.4V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.225V |
| Speed | 852MHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
| Core Processor | ARM® Cortex®-A9 |
| Address Bus Width | 16 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| External Data Bus Width | 64 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 4 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| Height Seated (Max) | 2.16mm |
| Length | 21mm |
| RoHS Status | ROHS3 Compliant |
The MCIMX6Q6AVT08AD automotive and infotainment processor represents the latest achievement in integrated multimedia applications processors. The MCIMX6Q6AVT08AD is a part of a growing family of multimedia-focused products that offer high-performance processing with a high degree of functional integration. The MCIMX6Q6AVT08AD targets the needs of the growing automotive infotainment, telematics, HMI, and display-based cluster markets.
Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and games
Multilevel memory system
Smart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations
Dynamic voltage and frequency scaling
Powerful graphics acceleration
Interface flexibility
Integrated power management throughout the device
Advanced hardware-enabled security
Heating Ventilation, and Air Conditioning (HVAC)
Mid to High Infotainment / eCockpit
Air Conditioning (AC)
Brushless DC Motor (BLDC) Control
Electricity Generation
Smart Watch
Fleet Management