| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
569-LFBGA |
| Operating Temperature |
-20°C~105°C TJ |
| Packaging |
Tray |
| Series |
i.MX6Q |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| HTS Code |
8542.39.00.01 |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Speed |
800MHz |
| Core Processor |
ARM® Cortex®-A9 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
4 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (4) |
| Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers |
Keypad, LCD |
| SATA |
SATA 3Gbps (1) |
| RoHS Status |
ROHS3 Compliant |
MCIMX6Q5EZK08AE Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 569-LFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 4 Core 32-Bit . Recognize operating temperatures around -20°C~105°C TJ. The i.MX6Q series contains it. A ARM? Cortex?-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor has CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to serve you better. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6Q5EZK08AE Features
ARM? Cortex?-A9 Core
MCIMX6Q5EZK08AE Applications
There are a lot of NXP USA Inc. MCIMX6Q5EZK08AE Microprocessor applications.
- Hand-held metering systems
- Office automation equipment and computer peripherals
- Toasters
- Current meter
- Fire detection & safety devices
- Industrial instrumentation devices
- Fax machines
- Embedded gateways
- 8. Navigation control field
- Multi-meter