| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
624-FBGA, FCBGA |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2002 |
| Series |
i.MX6DP |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
852MHz |
| Core Processor |
ARM® Cortex®-A9 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, DDR3L, DDR3 |
| USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
| Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
| Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
| SATA |
SATA 3Gbps (1) |
| RoHS Status |
ROHS3 Compliant |
MCIMX6DP4AVT8AAR Overview
The embedded microprocessor has been packed in 624-FBGA, FCBGA for convenient overseas shipping. High reliability is provided by the advanced packaging method Tape & Reel (TR). In the CPU, there are 2 Core 32-Bit cores and 2 Core 32-Bit bus width. Be aware of the operating temperature around -40°C~125°C TJ. In the series i.MX6DP, it is found. A ARM? Cortex?-A9 processor powers this CPU. The CPU contains LPDDR2, DDR3L, DDR3 RAM controllers. This microprocessor features CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces to better serve its users. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6DP4AVT8AAR Features
ARM? Cortex?-A9 Core
MCIMX6DP4AVT8AAR Applications
There are a lot of NXP USA Inc. MCIMX6DP4AVT8AAR Microprocessor applications.
- Glucose monitoring systems (for Type 1 Diabetes)
- PDAs, game consoles
- Automobile
- Embedded gateways
- Robotic prosthetic limbs
- Wastewater treatment
- Safety -airbags, automatic braking system (ABS)
- Playstation
- Volt meter
- Oil and gas