MCIMX6DP4AVT1ABR
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-FBGA, FCBGA |
| Supplier Device Package | 624-FCBGA (21x21) |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2002 |
| Series | i.MX6DP |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, DDR3L, DDR3 |
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
| Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
MCIMX6DP4AVT1ABR Overview
Packed in 624-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. High reliability is provided by the advanced packaging method Tape & Reel (TR). There are 2 Core 32-Bit cores per bus width on the CPU. K-40°C~125°C TJw what the operating temperature is around -40°C~125°C TJ. A i.MX6DP series item. A ARM? Cortex?-A9 processor is present in this CPU. A CPU with this architecture uses LPDDR2, DDR3L, DDR3 RAM controllers. Microprocessors with CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces are designed to serve users better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V. A supplier offers a 624-FCBGA (21x21) package.
MCIMX6DP4AVT1ABR Features
ARM? Cortex?-A9 Core
MCIMX6DP4AVT1ABR Applications
There are a lot of NXP USA Inc. MCIMX6DP4AVT1ABR Microprocessor applications.
- Radio
- Security systems
- Process control devices
- Fire alarms
- Playstation
- Dialysis machines (performs function of liver)
- Fabric
- Printers
- Automatic staplers
- Smartphone