MCIMX6D6AVT08AER
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Package / Case | 624-FBGA, FCBGA |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2002 |
| Series | i.MX6D |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 852MHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
MCIMX6D6AVT08AER Overview
Since the microprocessor is packed in 624-FBGA, FCBGA, shipping overseas is convenient. High reliability is provided by the advanced packaging method Tape & Reel (TR). There are 2 Core 32-Bit cores per bus width on the CPU. Identify the operating temperature around -40°C~125°C TJ. i.MX6D is its series number. The CPU is cored by a processor with a number of 0 cores. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU.
MCIMX6D6AVT08AER Features
ARM? Cortex?-A9 Core
MCIMX6D6AVT08AER Applications
There are a lot of NXP USA Inc. MCIMX6D6AVT08AER Microprocessor applications.
- Instrumentation and process control field
- Communication-bluetooth, Wi-Fi, radio
- 3D printers
- Firewalls
- Television
- Refrigerators
- Wastewater treatment
- PDAs, game consoles
- Ipad
- Hearing aids