| Parameters |
| Factory Lead Time |
12 Weeks |
| Package / Case |
624-FBGA, FCBGA |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tray |
| Published |
2002 |
| Series |
i.MX6D |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Speed |
852MHz |
| Core Processor |
ARM® Cortex®-A9 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (4) |
| Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers |
Keypad, LCD |
| SATA |
SATA 3Gbps (1) |
| RoHS Status |
ROHS3 Compliant |
MCIMX6D6AVT08AE Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. The CPU has 2 Core 32-Bit cores/Bus width. It is important to understand the operating temperature around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6D series. A ARM? Cortex?-A9 processor powers this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V.
MCIMX6D6AVT08AE Features
ARM? Cortex?-A9 Core
MCIMX6D6AVT08AE Applications
There are a lot of NXP USA Inc. MCIMX6D6AVT08AE Microprocessor applications.
- Glucose monitoring systems (for Type 1 Diabetes)
- Torpedo guidance
- Security systems
- Guidance-GPS
- Fire alarms
- Process control devices
- Vacuum cleaners
- Instrument control
- Consumer electronics products
- Industrial instrumentation devices