| Parameters |
| Package / Case |
241-BEPGA |
| Operating Temperature |
0°C~70°C TA |
| Packaging |
Tray |
| Published |
1995 |
| Series |
M683xx |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Base Part Number |
MC68EN360 |
| Speed |
33MHz |
| Core Processor |
CPU32+ |
| Voltage - I/O |
5.0V |
| Ethernet |
10Mbps (1) |
| Number of Cores/Bus Width |
1 Core 32-Bit |
| Graphics Acceleration |
No |
| RAM Controllers |
DRAM |
| Additional Interfaces |
SCC, SMC, SPI |
| Co-Processors/DSP |
Communications; CPM |
| RoHS Status |
ROHS3 Compliant |
MC68EN360RC33L Overview
The microprocessor is convenient for international shipping since it is packaged in 241-BEPGA. A high level of reliability is provided by using an advanced packaging method Tray. There are 1 Core 32-Bit cores per bus width on the CPU. It is important to understand the operating temperature around 0°C~70°C TA. In the M683xx series, it is found. The CPU is cored with a CPU32+ processor. There are DRAM RAM controllers on this CPU. This microprocessor features SCC, SMC, SPI interfaces to better serve its users. This CPU runs I/O at 5.0V. Use MC68EN360 when searching for variants of the embedded microprocessor.
MC68EN360RC33L Features
CPU32+ Core
MC68EN360RC33L Applications
There are a lot of NXP USA Inc. MC68EN360RC33L Microprocessor applications.
- Safety -airbags, automatic braking system (ABS)
- Home video and audio
- Oscilloscopes
- Gas monitoring systems
- Digital cameras
- Virtual reality VR robots
- Agriculture, transportation field
- Hearing aids
- Dryers
- Fire detection & safety devices