MC35FS6510NAE
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6510NAE Overview
Tray is an acceptable method of shipping the power management.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is targeted at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~150°C TA will prevent malfunctions.The power management runs on 1V~5V voltage.The manage ics are based on the Automotive, AEC-Q100 series.
MC35FS6510NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6510NAE Applications
There are a lot of NXP USA Inc. MC35FS6510NAEPower Management applications.
- 4K Ultra High Definition (UHD) Display
- Chromebook
- Telecommunications Equipment
- Production Test
- SmartPhones
- Optical imaging payload
- Applications Processors
- Servers
- Debug
- Termination Voltage