MC35FS6502CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6502CAER2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.Among other applications, this power management targets System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~150°C TA in order to prevent malfunctions.This power management uses 1V~5V voltage for work.The manage ics belongs to Automotive, AEC-Q100 series.
MC35FS6502CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6502CAER2 Applications
There are a lot of NXP USA Inc. MC35FS6502CAER2Power Management applications.
- Wireless routers
- Digital Signage
- Hearing Aids
- Office Electronics
- GPS
- Cordless Phone Base Station
- Industrial/ATE
- I/Os (FPGAs, ASICs, DSPs)
- Tablets
- Digital Cores