MC35FS6501NAE
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6501NAE Overview
Tray is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.It targets applications such as System Basis Chip and others.It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA to prevent malfunctions.The power management works at 1V~5V voltage.It are possible to search for similar manage icss based on Automotive, AEC-Q100 .
MC35FS6501NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6501NAE Applications
There are a lot of NXP USA Inc. MC35FS6501NAEPower Management applications.
- Termination Voltage
- Switches
- Wireless routers
- Field Service
- Electronic Measurement Units
- Port/cable dongles
- LP2996-N: DDR1 Termination Voltage
- Automotive Infotainment
- Set-Top-Box
- Equipment Run-Off of Battery Backup