MC33PF8200ESES
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.7V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200ESES Overview
Tray is acceptable as a shipping the power management method.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.As a result, this power management is powered by 2.7V~5.5V voltage.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received much praise.
MC33PF8200ESES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200ESES Applications
There are a lot of NXP USA Inc. MC33PF8200ESESPower Management applications.
- FPGA, DSP Core Power
- Portable Navigation Devices
- Electronic Test Equipment
- FPGA
- LP2996A: DDR3L
- Surround view system ECU
- Telecommunications Equipment
- Portable Systems
- Electronic Test Instrumentation
- Applications Processors