MC33PF8100A0ES
| Parameters | |
|---|---|
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
MC33PF8100A0ES Overview
Shipments can be made in the direction of Tray .A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.There are a number of applications targeted at High Performance i.MX 8, S32x Processor Based .Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.The power management operates at a voltage of 2.5V~5.5V volts.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received lots of praise.
MC33PF8100A0ES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100A0ES Applications
There are a lot of NXP USA Inc. MC33PF8100A0ESPower Management applications.
- Medical
- DDR-II Termination Voltage
- Surround view system ECU
- LTE modem
- Optical imaging payload
- System Thermal for Servers
- System Health Prognostics
- Telecommunications Equipment
- FPGA
- Automotive Infotainment