MC33FS6523NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6523NAER2 Overview
Tape & Reel (TR) is an acceptable method of shipping the power management.Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptation, Surface Mount is a universal mounting method.At System Basis Chip and other applications, this power management is targeted.Ensure that the operating temperature of the power management ic is set to -40°C~125°C in order to prevent malfunctions.It works with 1V~5V voltage.
MC33FS6523NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6523NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6523NAER2Power Management applications.
- LP2996-N: DDR1 Termination Voltage
- SSTL-2 Termination
- Electronic Test Equipment
- Peripheral I/O Power
- Projection Mapping
- GPS
- Port/cable adapters
- Netbooks
- Port/cable dongles
- DDR-II Termination Voltage