MC33FS6512NAE
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6512NAE Overview
Using Tray as a shipping the power management path is acceptable.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.It targets applications such as System Basis Chip and others.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, this power management requires 1V~5V voltage.
MC33FS6512NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512NAE Applications
There are a lot of NXP USA Inc. MC33FS6512NAEPower Management applications.
- Portable Navigation Devices
- DDR2 Termination Voltage
- Networking Equipment
- Peripheral I/O Power
- Automotive Digital Cluster
- FPGA
- Digital Signage
- Tablets
- LTE modem
- Motherboard