MC33FS6512CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6512CAER2 Overview
It is acceptable to ship using the method Tape & Reel (TR) .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is targeted at System Basis Chip and other applications.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .1V~5V voltage is used for the operation of this power management.
MC33FS6512CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6512CAER2Power Management applications.
- Medical
- Hardware Monitoring for Servers
- Hand-Held Systems
- Industrial Telemetry Applications
- DDR2 Termination Voltage
- Data Storage
- Radar
- Telecommunications Equipment
- DSP
- Industrial applications