MC33FS4502NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502NAER2 Overview
Using Tape & Reel (TR) as a shipping the power management path is acceptable.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For easy adaptation, Surface Mount is a universal mounting method.There are a number of applications targeted at System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~125°C in order to prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS4502NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502NAER2 Applications
There are a lot of NXP USA Inc. MC33FS4502NAER2Power Management applications.
- LP2996A: DDR1
- Electronic Test Instrumentation
- Measurement of Point Voltages
- Communications payload
- Camera Power Applications
- Electronic Test Equipment
- Networking Equipment
- System Health Prognostics
- Desktop PC
- Computing