MC33FS4502LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502LAER2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.For easy adaptation, Surface Mount is a universal mounting method.The power management is designed for use with applications at System Basis Chip .The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management runs on 1V~5V voltage.
MC33FS4502LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502LAER2 Applications
There are a lot of NXP USA Inc. MC33FS4502LAER2Power Management applications.
- DSP
- Automotive camera module
- Automotive head unit
- Tablets
- Cluster
- Memory Power
- Automotive Infotainment
- HSTL Termination
- FPGA, DSP Core Power
- 4K Ultra High Definition (UHD) Display